Thales is a globaltechnologyleader with more than 81,000 employees on five continents. The Group is investing in digital and “deep tech” innovations – Big Data, artificial intelligence, connectivity, cybersecurity and quantum technology – to build a future we can all trust.
Location: Bangalore - Indraprastha, India Technical Lead - Mixed Signal Design Thales India Engineering Competency Center in Bangalore is seeking a Tech Lead Engineer role. In this role you will be responsible for generating reliable, cost effective, customized Electronics systems design, Obsolescence redesign for Defense products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.). You also perform trade analysis of design approaches, engineering simulations modeling, derating analysis before finalizing the design. Qualifications: B.Tech in Electronics Communication or Electrical engineering or equivalent with 8 to 12 years of relevant experience. Higher qualifications of Post-graduation and PhD are desirable. Working experience in Avionics and Defense systems design is desirable Technical Skills and Competencies: Must have strong experience in Product design and development from requirements to Conceptual design to architectural design to detailed design and analysis Must have strong experience in designing low to high power analog electronic boards (for example, power supply, signal processing etc) for Defense / avionics Industry Must have Strong knowledge in Specification, design and verification of electronic boards (including digital functions) Must have strong knowledge of using simulation tools (SPICE, ANSYS etc) for functional simulation signal integrity and power integrity analyses Must have working experience of product performance evaluation (Hardware Verification) and product qualification to comply to DO-160 and DO-254 standards Must have excellent troubleshooting skills on Electrical / Electronic boards to find the root cause and to propose the best solution Should have experience of working with multi-disciplinary team (Mechanical team for thermal analysis enclosures design, PCB layout team and suppliers) Should have an understanding and use of DFMEA, DFT and DFM tools Definition and choice of components (including derating) Definition of electrical schematics and building blocks Boards placeroute (including signal integrity) Manufacturing failures analysis / Root cause analysis Test procedures definition and execution Component obsolescence treatment : alternative solution identification, definition/design of the solution, verification Profile/Skills Analog Electronic Engineering Skills and ability. Mastering of electronic simulation and design software (Cadence, Allegro, ANSYS, PSPICE/LTSPICE) Knowledge or Defense, aeronautics constraints (MIL-STD, DO160, DO254) Design for manufacturing Design for environmental requirements including EMC General understanding of Engineering Development lifecycles including design, development, testing, verification and validation phases
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